Difference between revisions of "Digital Twin Technology"
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==Level 1 (Market Level):== | ==Level 1 (Market Level):== | ||
* Focuses on the broader market context for | * Focuses on the broader market context for Embrear to revolutionize their manufacturing facilities, primarily focusing on'''Industry 4.0'''. | ||
* The market demands and technological trends that drive the need for Digital Twin solutions are addressed here. | * The market demands, and technological trends that drive the need for Digital Twin solutions are addressed here. | ||
==Level 2 (Product/Technology Level):== | ==Level 2 (Product/Technology Level):== | ||
* This is the product or overarching technology level, dealing with the general '''2DTT Digital Twin Technology''' | * This is the product or overarching technology level, dealing with the general '''2DTT Digital Twin Technology''' and its strategic significance to industry needs. | ||
* | * Level 2 encompasses the overall architecture and essential components of Digital Twin, such as '''Physical Technology Integration''' and '''Smart Industry Platforms'''. | ||
==Level 3 (System/Facility Level):== | ==Level 3 (System/Facility Level):== | ||
* The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities. | * The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities. | ||
* Key areas covered include | * Key areas covered include technology implementation in product, facility, and operations. Level 3 covers end-to-end integration and system-level optimization. | ||
==Level 4 (Subsystem Level):== | ==Level 4 (Subsystem Level):== | ||
* At this level, the subsystems and digital enablers are detailed, such as '''Modeling & Simulation''', '''Sensor Integration''', '''CAD Data Integration''', '''AI & Analytics''', '''Process Control Systems | * At this level, the subsystems and digital enablers are detailed, such as '''Modeling & Simulation''', '''Sensor Integration''', '''CAD Data Integration''', '''AI & Analytics''', '''Process Control Systems'', and ''' Digital Threads'''. | ||
* | * Level 4 subsystems are pivotal in effectively deploying Digital Twins across different environments. | ||
==Level 5 (Component Level):== | ==Level 5 (Component Level):== | ||
* The roadmap moves to specific components like '''Edge Units''', '''Real-Time Monitoring Sensors''', '''Data Storage Structures''', '''Predictive Maintenance Algorithms''', and '''Quality Control Analysis'''. | * The roadmap moves to specific components like '''Edge Units''', '''Real-Time Monitoring Sensors''', '''Data Storage Structures''', '''Predictive Maintenance Algorithms''', and '''Quality Control Analysis'''. | ||
* | * Level 5 components ensure the robust performance of digital twin models by continuously feeding real-time data and predictive insights into the system. | ||
==Level 6 (Technology or Tool Level):== | ==Level 6 (Technology or Tool Level):== | ||
* Finally, at the most granular level, individual technologies or tools such as '''AI/ML Models | * Finally, at the most granular level, individual technologies or tools such as '''AI/ML Models'', '''Encryption Mechanisms''', '''Authentication Systems'' and '''Digital Twins Interoperability Tools'' are addressed. | ||
* | * Level 6 elements ensure that the Digital Twin systems are secure, scalable, and integrated with other enterprise systems. | ||
Revision as of 23:23, 9 October 2024
Roadmap Creators: Abhay Chauhan, Dax Contreras, and Sai Prasad Balla
Technology Roadmap Sections and Deliverables
Our technology roadmap identifier is shown as:
- 2DTT - Digital Twin Technology
This identifier represents a Level 2 technology roadmap focused on product-level aspects of Digital Twin Technology. The roadmap is segmented into various tiers, with each level becoming more granular and specific as it progresses.
Level 1 (Market Level):
- Focuses on the broader market context for Embrear to revolutionize their manufacturing facilities, primarily focusing onIndustry 4.0.
- The market demands, and technological trends that drive the need for Digital Twin solutions are addressed here.
Level 2 (Product/Technology Level):
- This is the product or overarching technology level, dealing with the general 2DTT Digital Twin Technology and its strategic significance to industry needs.
- Level 2 encompasses the overall architecture and essential components of Digital Twin, such as Physical Technology Integration and Smart Industry Platforms.
Level 3 (System/Facility Level):
- The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities.
- Key areas covered include technology implementation in product, facility, and operations. Level 3 covers end-to-end integration and system-level optimization.
Level 4 (Subsystem Level):
- At this level, the subsystems and digital enablers are detailed, such as Modeling & Simulation', Sensor Integration, CAD Data Integration, AI & Analytics, Process Control Systems, and Digital Threads.
- Level 4 subsystems are pivotal in effectively deploying Digital Twins across different environments.
Level 5 (Component Level):
- The roadmap moves to specific components like Edge Units, Real-Time Monitoring Sensors, Data Storage Structures, Predictive Maintenance Algorithms, and Quality Control Analysis.
- Level 5 components ensure the robust performance of digital twin models by continuously feeding real-time data and predictive insights into the system.
Level 6 (Technology or Tool Level):
- Finally, at the most granular level, individual technologies or tools such as AI/ML Models, Encryption Mechanisms', Authentication Systems and Digital Twins Interoperability Tools are addressed.
- Level 6 elements ensure that the Digital Twin systems are secure, scalable, and integrated with other enterprise systems.