Difference between revisions of "Digital Twin Technology"
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=Technology Roadmap Sections and Deliverables= | =Technology Roadmap Sections and Deliverables= | ||
Our technology roadmap identifier is shown as: | Our technology roadmap identifier is shown as: | ||
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This identifier represents a Level 2 technology roadmap focused on product-level aspects of Digital Twin Technology. The roadmap is segmented into various tiers, with each level becoming more granular and specific as it progresses. | This identifier represents a Level 2 technology roadmap focused on product-level aspects of Digital Twin Technology. The roadmap is segmented into various tiers, with each level becoming more granular and specific as it progresses. | ||
Level 1 (Market Level): Focuses on the broader market context for Embraer to revolutionize their manufacturing facilities, primarily focusing on '''Industry 4.0'''. The market demands and technological trends that drive the need for Digital Twin solutions are addressed here. | ==Level 1 (Market Level):== | ||
* Focuses on the broader market context for Embraer to revolutionize their manufacturing facilities, primarily focusing on '''Industry 4.0'''. | |||
* The market demands and technological trends that drive the need for Digital Twin solutions are addressed here. | |||
Level 2 (Product/Technology Level): This is the product or overarching technology level, dealing with the general '''2DTT Digital Twin Technology''' and its strategic significance to industry needs. Level 2 encompasses the overall architecture and essential components of Digital Twin, such as '''Physical Technology Integration''' and '''Smart Industry Platforms'''. | ==Level 2 (Product/Technology Level):== | ||
* This is the product or overarching technology level, dealing with the general '''2DTT Digital Twin Technology''' and its strategic significance to industry needs. | |||
* Level 2 encompasses the overall architecture and essential components of Digital Twin, such as '''Physical Technology Integration''' and '''Smart Industry Platforms'''. | |||
Level 3 (System/Facility Level): The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities. Key areas covered include technology implementation in product, facility, and operations. Level 3 covers end-to-end integration and system-level optimization. | ==Level 3 (System/Facility Level):== | ||
* The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities. | |||
* Key areas covered include technology implementation in product, facility, and operations. Level 3 covers end-to-end integration and system-level optimization. | |||
Level 4 (Subsystem Level): At this level, the subsystems and digital enablers are detailed, such as '''Modeling & Simulation''', '''Sensor Integration''', '''CAD Data Integration''', '''AI & Analytics''', '''Process Control Systems''', and '''Digital Threads'''. Level 4 subsystems are pivotal in effectively deploying Digital Twins across different environments. | ==Level 4 (Subsystem Level):== | ||
* At this level, the subsystems and digital enablers are detailed, such as '''Modeling & Simulation''', '''Sensor Integration''', '''CAD Data Integration''', '''AI & Analytics''', '''Process Control Systems''', and '''Digital Threads'''. | |||
* Level 4 subsystems are pivotal in effectively deploying Digital Twins across different environments. | |||
Level 5 (Component Level): The roadmap moves to specific components like '''Edge Units''', '''Real-Time Monitoring Sensors''', '''Data Storage Structures''', '''Predictive Maintenance Algorithms''', and '''Quality Control Analysis'''. Level 5 components ensure the robust performance of digital twin models by continuously feeding real-time data and predictive insights into the system. | ==Level 5 (Component Level):== | ||
* The roadmap moves to specific components like '''Edge Units''', '''Real-Time Monitoring Sensors''', '''Data Storage Structures''', '''Predictive Maintenance Algorithms''', and '''Quality Control Analysis'''. | |||
* Level 5 components ensure the robust performance of digital twin models by continuously feeding real-time data and predictive insights into the system. | |||
Level 6 (Technology or Tool Level): Finally, at the most granular level, individual technologies or tools such as '''AI/ML Models''', '''Encryption Mechanisms''', '''Authentication Systems''', and '''Digital Twins Interoperability Tools''' are addressed. Level 6 elements ensure that the Digital Twin systems are secure, scalable, and integrated with other enterprise systems. | ==Level 6 (Technology or Tool Level):== | ||
* Finally, at the most granular level, individual technologies or tools such as '''AI/ML Models''', '''Encryption Mechanisms''', '''Authentication Systems''', and '''Digital Twins Interoperability Tools''' are addressed. | |||
* Level 6 elements ensure that the Digital Twin systems are secure, scalable, and integrated with other enterprise systems. | |||
Revision as of 23:28, 9 October 2024
Technology Roadmap Sections and Deliverables
Our technology roadmap identifier is shown as:
- 2DTT - Digital Twin Technology
This identifier represents a Level 2 technology roadmap focused on product-level aspects of Digital Twin Technology. The roadmap is segmented into various tiers, with each level becoming more granular and specific as it progresses.
Level 1 (Market Level):
- Focuses on the broader market context for Embraer to revolutionize their manufacturing facilities, primarily focusing on Industry 4.0.
- The market demands and technological trends that drive the need for Digital Twin solutions are addressed here.
Level 2 (Product/Technology Level):
- This is the product or overarching technology level, dealing with the general 2DTT Digital Twin Technology and its strategic significance to industry needs.
- Level 2 encompasses the overall architecture and essential components of Digital Twin, such as Physical Technology Integration and Smart Industry Platforms.
Level 3 (System/Facility Level):
- The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities.
- Key areas covered include technology implementation in product, facility, and operations. Level 3 covers end-to-end integration and system-level optimization.
Level 4 (Subsystem Level):
- At this level, the subsystems and digital enablers are detailed, such as Modeling & Simulation, Sensor Integration, CAD Data Integration, AI & Analytics, Process Control Systems, and Digital Threads.
- Level 4 subsystems are pivotal in effectively deploying Digital Twins across different environments.
Level 5 (Component Level):
- The roadmap moves to specific components like Edge Units, Real-Time Monitoring Sensors, Data Storage Structures, Predictive Maintenance Algorithms, and Quality Control Analysis.
- Level 5 components ensure the robust performance of digital twin models by continuously feeding real-time data and predictive insights into the system.
Level 6 (Technology or Tool Level):
- Finally, at the most granular level, individual technologies or tools such as AI/ML Models, Encryption Mechanisms, Authentication Systems, and Digital Twins Interoperability Tools are addressed.
- Level 6 elements ensure that the Digital Twin systems are secure, scalable, and integrated with other enterprise systems.