Difference between revisions of "Digital Twin Technology"

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Roadmap Creators: Abhay Chauhan,Dax Contreras, and Sai Prasad Balla
Roadmap Creators: Abhay Chauhan, Dax Contreras, and Sai Prasad Balla
 
=Technology Roadmap Sections and Deliverables=
Our technology roadmap identifier is shown as:
* '''2DTT - Digital Twin Technology'''
This identifier represents a Level 2 technology roadmap focused on product-level aspects of Digital Twin Technology. The roadmap is segmented into various tiers, with each level becoming more granular and specific as it progresses.
 
==Level 1 (Market Level):==
* Focuses on the broader market context for Digital Twin Technology, including industry trends like '''Industry 4.0''' and '''Smart Manufacturing'''.
* The market demands and technological trends that drive the need for Digital Twin solutions are addressed here.
 
==Level 2 (Product/Technology Level):==
* This is the product or overarching technology level, dealing with the general '''2DTT Digital Twin Technology''' as a whole and its strategic significance to industry needs.
* This level encompasses the overall architecture and essential components of Digital Twin, such as '''Physical Technology Integration''' and '''Smart Industry Platforms'''.
 
==Level 3 (System/Facility Level):==
* The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities.
* Key areas covered include '''Digital Twin for Products''', '''Digital Twin for Manufacturing Facilities''', and '''Digital Twin for Production Operations'''. These cover end-to-end integration and system-level optimization.
 
==Level 4 (Subsystem Level):==
* At this level, the subsystems and digital enablers are detailed, such as '''Modeling & Simulation''', '''Sensor Integration''', '''CAD Data Integration''', '''AI & Analytics''', '''Process Control Systems''', and '''Digital Threads'''.
* These subsystems play a pivotal role in the effective deployment of Digital Twins across different environments.
 
==Level 5 (Component Level):==
* The roadmap moves to specific components like '''Edge Units''', '''Real-Time Monitoring Sensors''', '''Data Storage Structures''', '''Predictive Maintenance Algorithms''', and '''Quality Control Analysis'''.
* These components ensure the robust performance of digital twin models by continuously feeding real-time data and predictive insights into the system.
 
==Level 6 (Technology or Tool Level):==
* Finally, at the most granular level, individual technologies or tools such as '''AI/ML Models''', '''Encryption Mechanisms''', '''Authentication Systems''', and '''Digital Twins Interoperability Tools''' are addressed.
* These elements ensure that the Digital Twin systems are secure, scalable, and integrated with other enterprise systems.

Revision as of 23:18, 9 October 2024

Roadmap Creators: Abhay Chauhan, Dax Contreras, and Sai Prasad Balla

Technology Roadmap Sections and Deliverables

Our technology roadmap identifier is shown as:

  • 2DTT - Digital Twin Technology

This identifier represents a Level 2 technology roadmap focused on product-level aspects of Digital Twin Technology. The roadmap is segmented into various tiers, with each level becoming more granular and specific as it progresses.

Level 1 (Market Level):

  • Focuses on the broader market context for Digital Twin Technology, including industry trends like Industry 4.0 and Smart Manufacturing.
  • The market demands and technological trends that drive the need for Digital Twin solutions are addressed here.

Level 2 (Product/Technology Level):

  • This is the product or overarching technology level, dealing with the general 2DTT Digital Twin Technology as a whole and its strategic significance to industry needs.
  • This level encompasses the overall architecture and essential components of Digital Twin, such as Physical Technology Integration and Smart Industry Platforms.

Level 3 (System/Facility Level):

  • The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities.
  • Key areas covered include Digital Twin for Products, Digital Twin for Manufacturing Facilities, and Digital Twin for Production Operations. These cover end-to-end integration and system-level optimization.

Level 4 (Subsystem Level):

  • At this level, the subsystems and digital enablers are detailed, such as Modeling & Simulation, Sensor Integration, CAD Data Integration, AI & Analytics, Process Control Systems, and Digital Threads.
  • These subsystems play a pivotal role in the effective deployment of Digital Twins across different environments.

Level 5 (Component Level):

  • The roadmap moves to specific components like Edge Units, Real-Time Monitoring Sensors, Data Storage Structures, Predictive Maintenance Algorithms, and Quality Control Analysis.
  • These components ensure the robust performance of digital twin models by continuously feeding real-time data and predictive insights into the system.

Level 6 (Technology or Tool Level):

  • Finally, at the most granular level, individual technologies or tools such as AI/ML Models, Encryption Mechanisms, Authentication Systems, and Digital Twins Interoperability Tools are addressed.
  • These elements ensure that the Digital Twin systems are secure, scalable, and integrated with other enterprise systems.