Difference between revisions of "Digital Twin Technology"
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Roadmap Creators: Abhay Chauhan,Dax Contreras, and Sai Prasad Balla | Roadmap Creators: Abhay Chauhan, Dax Contreras, and Sai Prasad Balla | ||
=Technology Roadmap Sections and Deliverables= | |||
Our technology roadmap identifier is shown as: | |||
* '''2DTT - Digital Twin Technology''' | |||
This identifier represents a Level 2 technology roadmap focused on product-level aspects of Digital Twin Technology. The roadmap is segmented into various tiers, with each level becoming more granular and specific as it progresses. | |||
==Level 1 (Market Level):== | |||
* Focuses on the broader market context for Digital Twin Technology, including industry trends like '''Industry 4.0''' and '''Smart Manufacturing'''. | |||
* The market demands and technological trends that drive the need for Digital Twin solutions are addressed here. | |||
==Level 2 (Product/Technology Level):== | |||
* This is the product or overarching technology level, dealing with the general '''2DTT Digital Twin Technology''' as a whole and its strategic significance to industry needs. | |||
* This level encompasses the overall architecture and essential components of Digital Twin, such as '''Physical Technology Integration''' and '''Smart Industry Platforms'''. | |||
==Level 3 (System/Facility Level):== | |||
* The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities. | |||
* Key areas covered include '''Digital Twin for Products''', '''Digital Twin for Manufacturing Facilities''', and '''Digital Twin for Production Operations'''. These cover end-to-end integration and system-level optimization. | |||
==Level 4 (Subsystem Level):== | |||
* At this level, the subsystems and digital enablers are detailed, such as '''Modeling & Simulation''', '''Sensor Integration''', '''CAD Data Integration''', '''AI & Analytics''', '''Process Control Systems''', and '''Digital Threads'''. | |||
* These subsystems play a pivotal role in the effective deployment of Digital Twins across different environments. | |||
==Level 5 (Component Level):== | |||
* The roadmap moves to specific components like '''Edge Units''', '''Real-Time Monitoring Sensors''', '''Data Storage Structures''', '''Predictive Maintenance Algorithms''', and '''Quality Control Analysis'''. | |||
* These components ensure the robust performance of digital twin models by continuously feeding real-time data and predictive insights into the system. | |||
==Level 6 (Technology or Tool Level):== | |||
* Finally, at the most granular level, individual technologies or tools such as '''AI/ML Models''', '''Encryption Mechanisms''', '''Authentication Systems''', and '''Digital Twins Interoperability Tools''' are addressed. | |||
* These elements ensure that the Digital Twin systems are secure, scalable, and integrated with other enterprise systems. |
Revision as of 23:18, 9 October 2024
Roadmap Creators: Abhay Chauhan, Dax Contreras, and Sai Prasad Balla
Technology Roadmap Sections and Deliverables
Our technology roadmap identifier is shown as:
- 2DTT - Digital Twin Technology
This identifier represents a Level 2 technology roadmap focused on product-level aspects of Digital Twin Technology. The roadmap is segmented into various tiers, with each level becoming more granular and specific as it progresses.
Level 1 (Market Level):
- Focuses on the broader market context for Digital Twin Technology, including industry trends like Industry 4.0 and Smart Manufacturing.
- The market demands and technological trends that drive the need for Digital Twin solutions are addressed here.
Level 2 (Product/Technology Level):
- This is the product or overarching technology level, dealing with the general 2DTT Digital Twin Technology as a whole and its strategic significance to industry needs.
- This level encompasses the overall architecture and essential components of Digital Twin, such as Physical Technology Integration and Smart Industry Platforms.
Level 3 (System/Facility Level):
- The roadmap breaks down into system-level components where the Digital Twin is implemented across specific systems or facilities.
- Key areas covered include Digital Twin for Products, Digital Twin for Manufacturing Facilities, and Digital Twin for Production Operations. These cover end-to-end integration and system-level optimization.
Level 4 (Subsystem Level):
- At this level, the subsystems and digital enablers are detailed, such as Modeling & Simulation, Sensor Integration, CAD Data Integration, AI & Analytics, Process Control Systems, and Digital Threads.
- These subsystems play a pivotal role in the effective deployment of Digital Twins across different environments.
Level 5 (Component Level):
- The roadmap moves to specific components like Edge Units, Real-Time Monitoring Sensors, Data Storage Structures, Predictive Maintenance Algorithms, and Quality Control Analysis.
- These components ensure the robust performance of digital twin models by continuously feeding real-time data and predictive insights into the system.
Level 6 (Technology or Tool Level):
- Finally, at the most granular level, individual technologies or tools such as AI/ML Models, Encryption Mechanisms, Authentication Systems, and Digital Twins Interoperability Tools are addressed.
- These elements ensure that the Digital Twin systems are secure, scalable, and integrated with other enterprise systems.